Carbon Nanotube Cooling Computer Chip (IMAGE) DOE/Lawrence Berkeley National Laboratory Caption Cooling microprocessor chips through the combination of carbon nanotubes and organic molecules as bonding agents is a promising technique for maintaining the performance levels of densely packed, high-speed transistors in the future. Credit Courtesy of Berkeley Lab's Molecular Foundry Usage Restrictions None License Licensed content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.