Contact: Michael Baum
michael.baum@nist.gov
301-975-2763
National Institute of Standards and Technology (NIST)

NIST 'Stress Tests' Probe Nanoscale Strains in Materials

Caption: Confocal Raman microscopy image of stress in a silicon crystal caused by indentation with a 20-micrometer-long wedge. The image does not show the silicon but rather the magnitude of stress in the crystal, with compressive stress around the wedge going up from the base line. Vampiric red 'fangs' reveal tensile stress associated with cracking at the ends of the indentation.

Credit: Stranick, NIST

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