Contact: Michael Mitchell
Ecole Polytechnique Fédérale de Lausanne
Caption: A new technology for stacking several layers of microprocesssors, which is being developed at EPFL in collaboration with ETHZ and IBM Research, could boost the performance of computer chips by a factor 10. The team estimates that the first 3-D chips will be implemented in supercomputers by 2015 with a novel internal cooling system fully operational by 2020, for even further improvements.
Credit: Reference: EPFL, LTCM, John R. Thome; Infograph: Pascal Coderay, firstname.lastname@example.org.
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