Contact: Mike Janes
DOE/Sandia National Laboratories
Caption: Sandia's Jeff Koplow makes an adjustment to an earlier prototype of his Air Bearing Heat Exchanger invention. The technology, as known as the "Sandia Cooler," will significantly reduce the energy needed to cool the processor chips in data centers and large-scale computing environments.
Credit: Photo by Dino Vournas
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Related news release: Sandia's 'cooler' technology offers fundamental breakthrough in heat transfer