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Contact: Monika Landgraf
presse@kit.edu
49-721-608-47414
Helmholtz Association of German Research Centres

The Wire Bond is Adapted to the Position and Orientation of the Chips.

Caption: The wire bond is adapted to the position and orientation of the chips.

Credit: Figure: N. Lindenmann and G. Balthasar

Usage Restrictions: None

Related news release: Optical waveguide connects semiconductor chips


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