The Wire Bond is Adapted to the Position and Orientation of the Chips. (image) Helmholtz Association Share Print E-Mail Caption The wire bond is adapted to the position and orientation of the chips. Credit Figure: N. Lindenmann and G. Balthasar Usage Restrictions None Share Print E-Mail Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.