Contact: Michael Mullaney
Rensselaer Polytechnic Institute
Caption: A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a new method for significantly increasing the heat transfer rate across two different materials. By sandwiching a layer of ultrathin “nanoglue” between copper and silica, the research team demonstrated a four-fold increase in thermal conductance at the interface between the two materials.
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Related news release: Nature Materials study: Boosting heat transfer with nanoglue