[ Back to EurekAlert! ]

Contact: Michael Mullaney
Rensselaer Polytechnic Institute

Boosting Heat Transfer With Nanoglue

Caption: A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a new method for significantly increasing the heat transfer rate across two different materials. By sandwiching a layer of ultrathin "nanoglue" between copper and silica, the research team demonstrated a four-fold increase in thermal conductance at the interface between the two materials.

Credit: Rensselaer/Ramanath

Usage Restrictions: Please include image credit

Related news release: Nature Materials study: Boosting heat transfer with nanoglue

[ Back to EurekAlert! ]