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Contact: Michael Mullaney
mullam@rpi.edu
518-276-6161
Rensselaer Polytechnic Institute

Boosting Heat Transfer With Nanoglue

Caption: A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a new method for significantly increasing the heat transfer rate across two different materials. By sandwiching a layer of ultrathin “nanoglue” between copper and silica, the research team demonstrated a four-fold increase in thermal conductance at the interface between the two materials.

Credit: Rensselaer/Ramanath

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Related news release: Nature Materials study: Boosting heat transfer with nanoglue


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