Contact: Michael Mullaney
Rensselaer Polytechnic Institute
Caption: Researchers from Rensselaer Polytechnic Institute's Department of Physics and Center for Integrated Electronics have developed a new inexpensive, quick-drying polymer that could lead to dramatic cost savings and efficiency gains in semiconductor manufacturing and computer chip packaging. In this series of scanning electron microscope images of the new PES polymer in a UV-imprint lithography application, the well-defined pattern indicates the material's potential for use in next-generation chip making techniques.
Credit: Rensselaer Polytechnic Institute
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