![[ Back to EurekAlert! ]](http://www.eurekalert.org/images/back2e.gif){kind=small}
|
Contact: Abby Vogel
avogel@gatech.edu
404-385-3364
Georgia Institute of Technology Research News
Caption: Scanning electron microscope image of two copper pillars bonded together using a novel fabrication technique. Placing these all-copper connections between computer chips and external circuitry will lead to increased computing speeds.
Credit: Image courtesy of Tyler Osborn
Usage Restrictions: None
Related news release: Researchers design copper connections for high-speed computing
|