Proposed process flow. (IMAGE)

Aerospace Information Research Institute, Chinese Academy of Sciences

Proposed process flow.

Caption

Proposed process flow. The developed fabrication methods consist of the following steps: a Spin-coated AZ-4562 positive photoresist over ITO-coated glass, b placing the prepared substrate on the sample holder of the 3D printing system and exposing light to obtain the desired pattern, c developing the exposed part of the photoresist, d thick film deposition of copper metal over ITO seed layer along the line of the given pattern, e spin-coated the protecting layer, f cutting the substrate into smaller pieces with a dicing saw, g removing the photoresist, h dry etching of the ITO seed layer with ICP, and i thermal annealing to strengthen copper structure.

Credit

Microsystems & Nanoengineering

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