The structural design of the microsensor and the principle of volume compressed sensing. (IMAGE)
Caption
The structural design of the microsensor and the principle of volume compressed sensing. a The resonant high pressure microsensor comprises a SOI wafer with resonators and vias, and a silicon wafer as cap for vacuum packaged. b The resonators anchor to the bulk of SOI and silicon cap through micro-beams and by modifying the micro-beams, two resonators behave different sensitivities to pressure. c While under pressure, the volume of the microsensor would be compressed, and the compressed deformation generates axial stresses on resonators through micro beams.
Credit
Microsystems & Nanoengineering
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