Encapsulation packaging process of metalenses with high-refractive-index (n) hydrogenated amorphous silicon (a-Si:H) (IMAGE)

Aerospace Information Research Institute, Chinese Academy of Sciences

Encapsulation packaging process of metalenses with high-refractive-index (n) hydrogenated amorphous silicon (a-Si:H)

Caption

a Fabrication process: (i) a-Si:H is deposited onto silica (SiO2) via plasma-enhanced chemical vapor deposition (PECVD). (ii) The film is patterned using electron-beam lithography, followed by Cr deposition and lift-off. (iii) a-Si:H nanostructures are created through etching, and the Cr layer is subsequently removed. (iv) Finally, encapsulated metalenses are fabricated with spin-on-glass (SoG) coating. b Schematic representation of design parameters: height (h), length (l), width (w), refractive index of meta-atom (nmeta) and period (p). c Electrical flux (D) distribution depending on varied nmeta with the parameters of h = 400 nm, l = 250 nm, w = 50 nm, and p = 400 nm, under x-polarized light illimitation at 635 nm. d Analytically derived minimum nmeta as a function of varying h

Credit

Microsystems & Nanoengineering

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