Bio-Inspired Copper Composite Achieves Zero Thermal Expansion with High Thermal Conductivity and Toughness (IMAGE)

Hefei Institutes of Physical Science, Chinese Academy of Sciences

Bio-Inspired Copper Composite Achieves Zero Thermal Expansion with High Thermal Conductivity and Toughness

Caption

A bioinspired laminated copper composite exhibiting zero thermal expansion, high directional thermal conductivity and superior toughness.

Credit

TONG Peng

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