Graphical illustration of the RC-PINN framework combined with Gaussian process uncertainty-guided sampling (GP-UGS) for data-efficient thermal field inversion in chiplet-based packaging. (IMAGE)

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Graphical illustration of the RC-PINN framework combined with Gaussian process uncertainty-guided sampling (GP-UGS) for data-efficient thermal field inversion in chiplet-based packaging.

Caption

Graphical illustration of the RC-PINN framework combined with Gaussian process uncertainty-guided sampling (GP-UGS) for data-efficient thermal field inversion in chiplet-based packaging.

Credit

Yupeng Qi et al., Materials Genome Institute, Shanghai University

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Credit must be given to the creator.

License

CC BY

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