Microstructural evolutions and failure mechanisms of tantalate HECs coatings subjected to differential thermal measurements (IMAGE)

Tsinghua University Press

Microstructural evolutions and failure mechanisms of tantalate HECs coatings subjected to differential thermal measurements

Caption

Schematic illustration of the two failure mechanisms of tantalate high-entropy ceramics coatings under thermal shock at 1500 °C and thermal fatigue at 1150 °C. During thermal shock, enormous thermal stress from temperature gradients and mismatches in thermal expansion coefficients drives transverse crack formation and coating spalling. During thermal fatigue, progressive TGO thickening and accumulative thermal stress lead to interfacial cracking when the h/R ratio exceeds 0.32, while sintering-induced stiffening causes surficial spalling.

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Journal of Advanced Ceramics, Tsinghua University Press

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