Construction of fermi-mediated electron-bridge (IMAGE)
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(a) Energy bands of metal and n-type semiconductor. (b) Fermi level alignment and electron flow within ohmic heterojunction. (c) Zn deposition on nanoparticles. (d) Fermi pinning caused by dangling bonds and chemical bonds formed with metals. (e) Ohmic heterojunction between Zn and hydrogen-bonded modified n-type semiconductors without chemical bonds.
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