BSPDN analysis with n-TSVs. (IMAGE)

Higher Education Press

BSPDN analysis with n-TSVs.

Caption

(a) Integration schematic of an n-TSV in BSPDN architecture; (b) high-AR n-TSV array configuration; (c) calculated thermal stress mappings in n-TSVs with (i) vertical and (ii) tapered sidewalls. Contour scale: 0–500 MPa. BPR: buried power rail.

Credit

Biao Wang, Feifeng Huang et al.

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License

CC BY-NC-ND

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