Mechanical characterization of textured silicon wafers via the three-point bending tests and surface morphology analysis of pyramid structures. (IMAGE)
Caption
(a) Schematic diagram illustrating the principle of the three-point bending test;
(b) experimental setup for the three-point bending test;
(c) load-displacement responses of silicon wafers with different thicknesses;
(d) SEM image of silicon surface with large-sized pyramids；
(e)SEM image of silicon surface with small-sized pyramids;
(f) load-displacement responses of silicon wafers with different pyramid sizes.
Credit
Qi Liu, Junjun Li, Fei Wang, Shuangbiao Xia, Yuhui Ji, Yutao Wang, Yunren Luo, Jian Yu, Fanying Meng, Liping Zhang, Zhengxin Liu & Wenzhu Liu.
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