Comparison between semiconductor logic folding and superconducting monolithic 3D active integration (IMAGE)

Beijing Zhongke Journal Publising Co. Ltd.

Comparison between semiconductor logic folding and superconducting monolithic 3D active integration

Caption

（a）semiconductor logic folding based on 3D package technology; (b) superconducting monolithic 3D active integration

Credit

Beijing Zhongke Journal Publishing Co. Ltd.

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Credit must be given to the creator.

License

CC BY

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