Ultra-thin spray cooling integrated with a silicon chip for high-power-density thermal management (IMAGE)

Science Exploration Press

Ultra-thin spray cooling integrated with a silicon chip for high-power-density thermal management

Caption

The ultra-thin spray cooling system integrates a 3.5-mm-thick micro-nozzle array with a silicon-based thermal test chip. The image shows the device structure and assembly, together with experimental measurements demonstrating its cooling and heat transfer performance at different heat fluxes and flow rates. The compact system achieved a peak heat transfer coefficient of 9.03 W/(cm²·K) and successfully dissipated more than 600 W of heat, highlighting a potential solution for thermal management in space-constrained, high-power-density electronics such as AI and high-performance computing chips.

Credit

© Hua Chen,Wen-Long Cheng,et al. 2026.

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Credit must be given to the creator.

License

CC BY

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