Rotary ultrasonic machining (RUM) promotes hybrid ductile-brittle material removal while drilling single-crystal silicon. Intermittent contact and localized crack suppression result in lower cutting force, improved hole quality, and minimal tool wear. (IMAGE)

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Rotary ultrasonic machining (RUM) promotes hybrid ductile-brittle material removal while drilling single-crystal silicon. Intermittent contact and localized crack suppression result in lower cutting force, improved hole quality, and minimal tool wear.

Caption

Rotary ultrasonic machining (RUM) promotes hybrid ductile-brittle material removal while drilling single-crystal silicon. Intermittent contact and localized crack suppression result in lower cutting force, improved hole quality, and minimal tool wear.

Credit

Kh M Asif Raihan / Kansas State University

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CC BY

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