Popping Materials and Devices in 3-D (5 of 6) (IMAGE)

American Association for the Advancement of Science (AAAS)

Popping Materials and Devices in 3-D (5 of 6)

Caption

This image shows complex 3-D silicon microstructures formed by compressive buckling. This material relates to a paper that appeared in the 9 Jan. 2015 issue of Science, published by the American Association for the Advancement of Science. The paper, by S. Xu at University of Illinois at Urbana-Champaign in Urbana, IL, and colleagues was titled, 'Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling.'

Credit

J. Rogers, University of Illinois

Usage Restrictions

Please cite the owner of the material when publishing. This material may be freely used by reporters as part of news coverage, with proper attribution. Non-reporters must contact <i>Science</i> for permission.

License

Licensed content

Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.