Silicon Wafer Containing Thousands of Pores with Contact Pads for Electrical Characterization (IMAGE)

University of Basel

Silicon Wafer Containing Thousands of Pores with Contact Pads for Electrical Characterization

Caption

Tiny pores were filled with molecules and brought into electrical contact via a platinum electrode from below and a gold nanoparticle electrode from above.

Credit

IBM Research - Zurich

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