Novel NIST Process Is a Low-Cost Route to Ultrathin Platinum Films (1 of 2) (IMAGE)
Caption
Schematic shows self-quenched platinum deposition on a gold surface. Under a high driving voltage, platinum in solution (bound to four chloride atoms) can shed the chloride and bind to a location on the gold. Hydrogen rapidly adsorbs on the platinum, ensuring that the platinum forms an even surface a single atom thick.
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Gokcen/NIST
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