Result of Wafer Bonding (IMAGE) National Institute for Materials Science, Japan Caption Cross-sectional transmission electron micrographs of the bonded interface between the single-crystal GMR film device and the polycrystalline electrode wafer (two photos at left) and magnetoresistance measured in the device post-bonding (right) Credit NIMS Usage Restrictions None License Licensed content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.