Hankering for Molecular Electronics? Grab the New NIST Sandwich (1 of 2) (IMAGE)

National Institute of Standards and Technology (NIST)

Hankering for Molecular Electronics? Grab the New NIST Sandwich (1 of 2)

Caption

The flip-chip lamination method creates an ultra-smooth gold surface, which allows the organic molecules to form a thin yet even layer between the gold and silicon.

Credit

Coll Bau, NIST

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