Closer hardware systems bring the future of artificial intelligence into view (IMAGE)

Institute of Industrial Science, The University of Tokyo

Closer hardware systems bring the future of artificial intelligence into view

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Researchers from the Institute of Industrial Science at The University of Tokyo, Kobe Steel, Ltd, and Kobelco Research Institute, Inc, develop high-density, energy-efficient 3D embedded RAM for artificial intelligence applications.

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Institute of Industrial Science, the University of Tokyo

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