Cracking a Tough Nut for the Semiconductor Industry (IMAGE)

National Institute of Standards and Technology (NIST)

Cracking a Tough Nut for the Semiconductor Industry

Caption

This is a typical low-k film test for material toughness using the new NIST technique. The indentation instrument that punches the triangular hole registers the forces involved. That plus the length of the resulting cracks determines the toughness of the film, which is about 2.4 micrometers thick. (Color added for clarity.)

Credit

NIST

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