Sonic Wafering Technology (IMAGE) Arizona State University Caption A gallium arsenide wafer cleaved in half using a Sonic Wafering technology developed in the Defect Engineering for Energy Conversion Technologies (DEfECT) Lab at ASU. Credit Deanna Dent/ASU Now Usage Restrictions None License Licensed content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.