Sonic Wafering Technology (IMAGE)

Arizona State University

Sonic Wafering Technology

Caption

A gallium arsenide wafer cleaved in half using a Sonic Wafering technology developed in the Defect Engineering for Energy Conversion Technologies (DEfECT) Lab at ASU.

Credit

Deanna Dent/ASU Now

Usage Restrictions

None

License

Licensed content

Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.