4H-SiCOI platform and microcavity preparation process (IMAGE)
Caption
(a) Fabrication process of pristine 4H-SiCOI material platform. (b) Photograph of a 4-inch wafer-scale 4H-SiCOI substrate fabricated using bonding and thinning method, the failure region is marked. (c) Total thickness variation of the 4H-SiCOI substrate. (d) Image of a 4H-SiCOI die. (e) Flowchart of fabricating a SiC microdisk resonator. (f) A scanning electron micrograph (SEM) of the fabricated microdisk resonator. (g) Zoom-in SEM image of the sidewall of the resonator. Inset, the atomic force micrograph (AFM) scan of the top surface of the resonator. (h) Side view SEM image of the fabricated resonator with parabolic-like shaped upper surface.
Credit
by Chengli Wang, Zhiwei Fang, Ailun Yi, Bingcheng Yang, Zhe Wang, Liping Zhou, Chen Shen, Yifan Zhu, Yuan Zhou, Rui Bao, Zhongxu Li, Yang Chen, Kai Huang, Jiaxiang Zhang, Ya Cheng and Xin Ou
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Credit must be given to the creator.
License
CC BY