Boosting Heat Transfer With Nanoglue (IMAGE)

Rensselaer Polytechnic Institute

Boosting Heat Transfer With Nanoglue

Caption

A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a new method for significantly increasing the heat transfer rate across two different materials. By sandwiching a layer of ultrathin “nanoglue” between copper and silica, the research team demonstrated a four-fold increase in thermal conductance at the interface between the two materials.

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Rensselaer/Ramanath

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