Fracture-Induced Structuring Process (IMAGE) Princeton University, Engineering School Caption Fracture-induced structuring results in the self-formation of periodic lines, or gratings, separated by as few as 60 nanometers -- less than one ten-thousandth of a millimeter -- on microchips. First, a thin polymer film is painted onto a rigid plate, such as a silicon wafer. Then, a second plate is placed on top, creating a polymer sandwich that is heated to ensure adhesion. Finally, the two plates are pried apart. As the film fractures, it automatically breaks into two complementary sets of nanoscale gratings, one on each plate. Credit Stephen Chou/Princeton University Usage Restrictions None License Licensed content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.