Too Hot & Too Cold is Just Right for Particle Assembly (IMAGE)

New York University

Too Hot & Too Cold is Just Right for Particle Assembly

Caption

Microscopic particles that bind under low temperatures (blue: bottom left) will melt as temperatures rise to moderate levels (green: center), but re-connect under hotter conditions (red: top right), a team of NYU scientists has found. Their discovery points to new ways to create "smart materials," cutting-edge materials that adapt to their environment by taking new forms, and to sharpen the detail of 3-D printing.

Credit

Image courtesy of Lang Feng.

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