Schematic of various optical systems that are capable of tackling the diverse challenges in patterned defect inspection (IMAGE)

International Journal of Extreme Manufacturing

Schematic of various optical systems that are capable of tackling the diverse challenges in patterned defect inspection

Caption

Diverse optical wafer defect inspection systems including (a) Brightfield/darkfield imaging system, (b) Dark-field imaging with null ellipsometry, (c) Through-focus scanning imaging microscopy, (d) Epi-diffraction phase microscopy, (e) Patterned wafer containing logic dies and 3D NAND memory dies, (f) X-ray ptychography, (g) THz wave-based defect inspection system, and (h) Coherent Fourier scatterometry techniques using different OAM illumination beams.

Credit

By Jinlong Zhu, Jiamin Liu, Tianlai Xu, Shuai Yuan, Zexu Zhang, Hao Jiang, Honggang Gu, Renjie Zhou, Shiyuan Liu.

Usage Restrictions

Credit must be given to the creator.

License

CC BY

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