The experiment and simulation result of W-SS steel sandwich structure at the bonding interface (IMAGE)
Caption
Both experiment and simulation results prove that the bonding mechanisms of SS→W and W→SS interface are different. When printing SS on the W base, the pre-printed W base cannot be re-melted by the laser energy for printing SS. The bonding was achieved by solid state diffusion (SSD) and grain boundary diffusion (GBD). The high energy beam formed a keyhole mode to build the W layer on the pre-printed SS base. In this process, the SS was melted and mixed with the liquid W to form the sinking W in the SS substrate and several new phases.
Credit
By Chao Wei, Heng Gu, Yuchen Gu, Luchao Liu, Yihe Huang, Dongxu Cheng, Zhaoqing Li, Lin Li.
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Credit must be given to the creator.
License
CC BY