3-D Microchips (image) Ecole Polytechnique Fédérale de Lausanne Share Print E-Mail Caption A new technology for stacking several layers of microprocesssors, which is being developed at EPFL in collaboration with ETHZ and IBM Research, could boost the performance of computer chips by a factor 10. The team estimates that the first 3-D chips will be implemented in supercomputers by 2015 with a novel internal cooling system fully operational by 2020, for even further improvements. Credit Reference: EPFL, LTCM, John R. Thome; Infograph: Pascal Coderay, firstname.lastname@example.org. Usage Restrictions None Share Print E-Mail Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.