Boosting Heat Transfer With Nanoglue (image) Rensselaer Polytechnic Institute Share Print E-Mail Caption A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a new method for significantly increasing the heat transfer rate across two different materials. By sandwiching a layer of ultrathin "nanoglue" between copper and silica, the research team demonstrated a four-fold increase in thermal conductance at the interface between the two materials. Credit Rensselaer/Ramanath Usage Restrictions Please include image credit Share Print E-Mail Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.