Novel NIST Process Is a Low-Cost Route to Ultrathin Platinum Films (1 of 2) (image) National Institute of Standards and Technology (NIST) Share Print E-Mail Caption Schematic shows self-quenched platinum deposition on a gold surface. Under a high driving voltage, platinum in solution (bound to four chloride atoms) can shed the chloride and bind to a location on the gold. Hydrogen rapidly adsorbs on the platinum, ensuring that the platinum forms an even surface a single atom thick. Credit Gokcen/NIST Usage Restrictions None Share Print E-Mail Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.