Professor Feng and the research team (IMAGE)

City University of Hong Kong

Professor Feng and the research team

Caption

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the packaging of 3D integrated circuit (3DIC) semiconductor chips. From right: Dr Mu Kaiyu, R&D Manager of Doctech, Ms Chang Yuhsueh, Research Assistant at CityUHK, Dr Yuen Muk-fung, R&D Manager, and Dr Huang Yu-Ting, CEO of Doctech.

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City University of Hong Kong

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