Illustration (IMAGE)

City University of Hong Kong

Illustration

Caption

An illustration of 3DIC advanced packaging, showing key metal interconnect structures, including Cu-Cu bonding, RDL and TSV/TGV. The team aims to develop electroplating copper solutions to control material microstructures to address the metallisation challenges in 3DIC packaging.

Credit

City University of Hong Kong

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Image must be used with appropriate caption and credit.

License

Original content

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