Figure 1 (IMAGE)

Tohoku University

Figure 1

Caption

Photograph of test chips fabricated on a silicon substrate using semiconductor integrated circuit manufacturing processes.

Credit

©Shunsuke Fukami, William A. Borders et al.

Usage Restrictions

Reporters may freely use these materials in news coverage with appropriate credit information.

License

Original content

Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.