Figure | Patterned wafer defect inspection based on L²-CPI. (IMAGE)
Caption
Figure | Patterned wafer defect inspection based on L²-CPI. a, The bright-field microscopic image of the patterned area and the L2-CPI-measured region (encircled by a white dashed box) on the IDA wafer. b, The SEM images of a bridge defect and a cutting defect. c, The reconstructed phase map of the selected area using L2-CPI, where the purple region containing IDA is used for comparison. d, The reconstructed phase maps for the bx-bridge defect area using L2-CPI and DHM, along with the simulated phase maps for a bx-bridge defect of the same size. Experimental phase map scale bar: 10 µm, simulated phase map scale bar: 1 µm. e, The reconstructed phase maps for the cutting defect areas using L2-CPI and DHM. Scale bar: 10 µm.
Credit
Jinlong Zhu et al.
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License
CC BY