New Spin Seebeck Thermoelectric Device with Higher Conversion Efficiency Created (2/2) (IMAGE)

Tohoku University

New Spin Seebeck Thermoelectric Device with Higher Conversion Efficiency Created (2/2)

Caption

Devices with bending resistance and low heat treatment temperature achieved by new deposition technology. New deposition technology fabricates a fine ferrite film for spin Seebeck thermoelectric devices at 90°C, much lower than the 700°C used with the conventional method. Owing to the decrease in heat treatment temperature, elements can be created on the surface of plastic film, etc., and flexible devices of various shapes are created.

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NEC Corporation

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Credit: NEC Corporation

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