Flip-Chip (IMAGE)

University of Illinois Grainger College of Engineering

Flip-Chip

Caption

The 'flip-chip' cleavage-based sample preparation: (A) A photo and a schematic diagram of assembled Bi2Se3(0001)/Nb sample structure before cleavage. (B) Same sample structure after cleavage exposing a 'fresh' surface of the Bi2Se3 film with a pre-determined thickness. Image courtesy of James Eckstein and Tai-Chang Chiang, U. of I. Department of Physics and Frederick Seitz Materials Research Laboratory.

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U. of I. Department of Physics and Frederick Seitz Materials Research Laboratory

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