Same Properties, Lower Cost (IMAGE) Tohoku University Caption Copper nanopastes with low-temperature sintering property for printed electronics and die attachment. Credit Kiyoshi Kanie Usage Restrictions Credit: Kiyoshi Kanie License Licensed content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.