Figure 1. (IMAGE)

The University of Osaka

Figure 1.

Caption

Acoustic emission (AE) was applied to monitor wear-out failure in discrete SiC Schottky barrier diode (SBD) devices with a Ag sinter die attachment, to successfully monitor the real-time progress of failure of Al ribbons for the first time. (a) Optical image of a SiC-SBD device. (b) Cross-sectional SEM image. (c) Experimental apparatus for power cycling tests and real-time AE monitoring. (d) Waveform of collected AE signal and its characteristic, including counts and amplitude. (e) Generation, propagation, and collection of AE signals (i.e., elastic waves) in power electronics during a power cycling test.

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Osaka University

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