Figure 2. (IMAGE)

The University of Osaka

Figure 2.

Caption

After eliminating background AE noise—including power on-off switching and ambient noise—via noise-filtering, AE signals were successfully collected for the SiC devices during a power cycling test. (a) Lift-off failure analysis results of failed discrete SiC-SBD devices after a power cycling test. (b) Cross section of one pre-failure Al ribbon where many cracks were observed at the interface. (c) AE single monitoring was compared with the traditional failure monitoring method: using the forward voltage during the power cycling test. The results indicate that AE monitoring can be used to understand fatigue propagation in Al ribbons (i.e., the failure mechanism) and also as an early warning before catastrophic lift-off fracture for power electronic devices.

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Osaka University

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