Hybrid modulator (IMAGE) Kyushu University Caption The silicon-polymer hybrid modulator seen here as a thin, black strip was developed by researchers in Japan and can transmit data at 200 Gbit/s at temperatures up to 110 °C. Modulators able to operate quickly at such high temperatures could reduce cooling demands in datacenters and unlock applications in harsh, poorly controlled environments such as cars, airplanes, and rooftops. Credit Shiyoshi Yokoyama, Kyushu University Usage Restrictions Only for media and non-commercial use. License Licensed content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.