Hybrid modulator (IMAGE)

Kyushu University

Hybrid modulator

Caption

The silicon-polymer hybrid modulator seen here as a thin, black strip was developed by researchers in Japan and can transmit data at 200 Gbit/s at temperatures up to 110 °C. Modulators able to operate quickly at such high temperatures could reduce cooling demands in datacenters and unlock applications in harsh, poorly controlled environments such as cars, airplanes, and rooftops.

Credit

Shiyoshi Yokoyama, Kyushu University

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