Jie with sample (IMAGE) University of Massachusetts Amherst Caption UMass Amherst Ph.D. student Jie Ren holds a miniature heatsink fan, one of the 3D printed high-entropy alloy components made in Wen Chen’s lab. The microstructure’s atomic rearrangement gives rise to ultrahigh strength as well as enhanced ductility, research by UMass Amherst and Georgia Tech shows. Credit UMass Amherst Usage Restrictions none License Original content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.