Next-gen high-accuracy high-pressure detection: volume compressed resonant microsensor sets new standards

A cutting-edge silicon resonant microsensor has been developed to meet the pressing demand for high-accuracy, wide-range pressure measurements in extreme environments. Designed using a novel volume compressed sensing mechanism, the sensor features two microbeam-supported resonators—each with distinct pressure sensitivities—that work together to enable intrinsic temperature compensation. This innovation not only protects the device under pressures up to 70 MPa but also delivers an impressive resolution of 100 Pascals. By merging smart structural design with advanced packaging, this microsensor offers a compelling new standard for high-resolution，high-accuracy pressure sensing in oceanographic, energy, and industrial applications.

High-pressure environments, such as deep-sea exploration and oil drilling, require pressure sensors that can endure extreme conditions without sacrificing accuracy. Traditional microelectro-mechanical system (MEMS)-based piezoresistive and capacitive sensors struggle with performance drift and mechanical stress at high pressures. Resonant pressure sensors offer better precision, but most rely on diaphragm deformation, which limits both pressure range and stability. Volume compressed sensing—a method that compresses the entire structure uniformly—has emerged as a promising alternative but remained difficult to apply in resonant designs due to mechanical buckling. Due to these limitations, there is a strong need to develop robust resonant microsensors that combine high accuracy, resilience, and temperature stability.

Researchers at the Aerospace Information Research Institute, Chinese Academy of Sciences, have developed a next-generation silicon resonant pressure microsensor, recently published (DOI: 10.1038/s41378-025-00957-9) in Microsystems & Nanoengineering (June 12, 2025). Leveraging volume compressed sensing and dual resonators supported by micro beams, the sensor achieves high-resolution pressure readings across a wide dynamic range. Uniquely, its design allows the sensor to automatically correct for temperature fluctuations—without external components—while maintaining a compact footprint. This breakthrough sets a new benchmark for pressure sensing technologies operating in extreme environments.

The sensor’s ingenuity lies in its dual-resonator system, where each resonator is supported by micro beams configured at different angles. This structural difference causes one resonator (Resonator I) to remain largely unaffected by pressure, serving as a reference for temperature compensation, while the other (Resonator II) responds sensitively to pressure changes. The research team formulated a detailed theoretical model that links micro-beam geometry to pressure sensitivity, which was confirmed through simulations and empirical measurements.

Fabricated via deep silicon etching and eutectic bonding, the sensor is vacuum-sealed and encased in an oil-filled, diaphragm-isolated structure to withstand complex hydraulic conditions. At 20 °C, the sensor demonstrated pressure sensitivities of approximately 30 ppm/MPa and −1311 ppm/MPa for Resonators I and II, respectively. With a total accuracy of better than ±0.01% FS across −10 to 50 °C and pressures from 0.1 to 70 MPa, it achieved a minimum detectable pressure of 100 Pa. This means the sensor has an error of less than 0.7 meters when measuring seawater depth at 7000 meters, and it can detect surges as small as 1 centimeter at such depths. These performance metrics reflect the sensor’s strong alignment with theoretical predictions and establish a robust foundation for high-pressure, high-precision applications.

“This microsensor represents a leap forward in pressure sensing,” said Assoc. Prof. Yulan Lu, corresponding author of the study. “By carefully tuning the micro-beam geometry and leveraging volume compression principles, we achieved both mechanical resilience and high signal precision. What makes this design truly powerful is its ability to self-correct for temperature shifts, eliminating the need for external compensation. Our results not only validate the theoretical model, but also offer a scalable approach for future sensor systems working in demanding industrial or scientific settings.”

This high-performance microsensor is poised to transform how pressure is monitored in extreme environments. Its compact size, fast response, and self-compensating accuracy make it ideally suited for subsea monitoring, downhole oil exploration, and aerospace instrumentation. By removing the need for external temperature sensors, the design simplifies integration and reduces error in real-time applications. The derived theoretical framework also offers a valuable roadmap for customizing sensor behavior through structural design, enabling tailored solutions across diverse fields. As the need for resilient, high-precision measurement tools grows, this innovation stands out as a critical advancement in MEMS sensor technology.

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References

DOI

10.1038/s41378-025-00957-9

Original Source URL

https://doi.org/10.1038/s41378-025-00957-9

Funding information

This work was funded in part by the National Key R&D Program of China under Grant 2023YFC2410600, in part by the National Natural Science Foundation of China under Grant 62301536 and Grant 62121003, in part by the Youth Innovation Promotion Association CAS Grant 2023134 and Grant 2022121, in part by the Shandong Province Science and Technology Small and Medium-sized Enterprises Innovation Ability Improvement Project under Grant 2023TSGC0211, and in part by the Instrument Research and Development of CAS under Grant PTYQ2024BJ0009.

About Microsystems & Nanoengineering

Microsystems & Nanoengineering is an online-only, open access international journal devoted to publishing original research results and reviews on all aspects of Micro and Nano Electro Mechanical Systems from fundamental to applied research. The journal is published by Springer Nature in partnership with the Aerospace Information Research Institute, Chinese Academy of Sciences, supported by the State Key Laboratory of Transducer Technology.