Light yet strong-inspired by egg whites!
KIMS developed an eco-friendly, highly thermally conductive heat-dissipating composite using a simple protein foaming method
National Research Council of Science & Technology
image: Fabrication Process of 3D MgO Skeleton and 3D MgO Composite Using the Protein Foaming Method
Credit: Korea Institute of Materials Science (KIMS)
A research team led by Dr. Hyun-Ae Cha from the Nano Materials Research Division at the Korea Institute of Materials Science (KIMS) has developed a high-performance heat-dissipating composite material that achieves both eco-friendliness and low-cost processing. The team utilized a protein foaming process based on egg whites to create a three-dimensional magnesium oxide (MgO) heat-dissipating structure, which forms efficient thermal pathways that enable rapid and effective heat transfer. As a result, the developed material demonstrated a thermal conductivity up to 2.6 times higher than that of conventional heat-dissipating composites.
As electronic devices continue to advance in performance and miniaturization, the amount of heat they generate increases, making effective thermal management technologies increasingly important. In the case of electric vehicles (EVs), insufficient cooling of the battery can lead not only to performance degradation but also to fires or explosions, highlighting the need for highly precise thermal management systems. At the core of such systems lies the Thermal Interface Material (TIM), which plays a crucial role in efficiently dissipating heat.
Conventional thermal interface materials (TIMs) are typically produced by mixing thermally conductive fillers—in the form of particles—into a polymer matrix. However, in this method, the fillers are randomly dispersed, which causes thermal pathways to break and makes it difficult to achieve sufficient performance. While increasing the filler content can improve thermal conductivity, it also leads to processing difficulties and higher material costs, limiting the scalability of the approach.
To address these challenges, the research team employed a protein foaming method to create a structure in which particles are densely and uniformly interconnected. Utilizing the property of egg-white proteins expanding at high temperatures, the team successfully formed a three-dimensional (3D) interconnected network of particles. This process enabled the creation of a composite material with continuous thermal pathways, preventing heat transfer from being interrupted. As a result, the team achieved a high-performance thermal interface material with a thermal conductivity of 17.19 W/m·K, demonstrating exceptional heat dissipation capability.
A key advantage of this achievement is that, despite using magnesium oxide (MgO)—a lightweight and low-cost material—the developed composite exhibited higher thermal conductivity than not only the commonly used aluminum oxide (Al₂O₃) but also nitride-based heat-dissipating materials. Furthermore, by combining the material with epoxy resin (a polymer typically used with thermal fillers to enhance adhesion), the team successfully fabricated a practically applicable composite suitable for real-world use.
This technology is expected to significantly enhance the performance and stability of various high-heat–generating devices, including electronic equipment, semiconductor packages, electric vehicle (EV) batteries, 5G communication devices, and high-performance servers. In particular, Korea’s domestic market for thermal interface materials (TIMs) is estimated to exceed KRW 200 billion annually, yet it still depends heavily on imports. Therefore, the commercialization of this technology is anticipated to make a substantial contribution to Korea’s technological self-reliance in the field of thermal management materials.
Dr. Hyun-Ae Cha who lead this research stated, “Through the protein foaming–based process, we can produce high–thermal–conductivity materials in an eco-friendly and cost-effective way.” She added, “This study serves as a strong example demonstrating the feasibility of developing lightweight, high-performance heat-dissipating materials.”
This research was funded by the Nano Materials Technology Development Program of the National Research Foundation of Korea (NRF). The research findings were published on May 28 in the world-renowned journal Advanced Science (Impact Factor: 15.1) and were selected as the cover article for Volume 12, Issue 33.
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About Korea Institute of Materials Science(KIMS)
KIMS is a non-profit government-funded research institute under the Ministry of Science and ICT of the Republic of Korea. As the only institute specializing in comprehensive materials technologies in Korea, KIMS has contributed to Korean industry by carrying out a wide range of activities related to materials science including R&D, inspection, testing&evaluation, and technology support.
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